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-In term of failure analysis,FIB techniques are commonly used in high magnification microscopy,die surface milling or cross-sectioning,and even material deposition.
就故障分析而言,聚焦离子束技术常用于高度放大率的显微术,模具型面铣削或剖面切削,甚至物质沉着研究.
-A FIB system work very similarly to a scanning electron microscopy,except that it uses a finely focused beam of gallium(Ga+) ions instead of the latter’s use of electrons.This focused primary beam of gallium ions is rastered (scanned) on the surface of material to be analyzed.As it hits the surface ,a small amount of material is sputtered or dislodged from the surface.
聚焦离子束系统的操作与扫描电子显微术很相似,不同的是它使用很精细的镓（Ga+）离子聚焦光束,而后者是使用电子.这聚焦的镓离子原射束在被分析的材料表面作光栅式扫描,当接触表面时,少数材料会从表面飞溅或喷出.
-The dislodged material may be in the form of secondary ions,atoms,and secondary electrons.These ions ,atoms,and electrons are then collected and analyzed as signals to form an image on a screen as the primary beams scans the surface ,This image forming capability allows high magnification microscopy.
溅出材料的形态可能是二次离子、原子及二次电子.当原射束扫描表面时,这些离子、原子及电子被收集和分析为信号在屏幕上形成图像.这种图像形成能力使高度放大显微术得以进行.
-The higher the primary beam current,the more material is sputtered from the surface.If only high-mag microscopy is intended,only a low-beam operation must be employed.
High-beam operation is used to sputter or remove material from the surface,such as during high-precision milling or cross-sectioning of an area die.
原射束流越高,从表面溅出的材料越多.如果只想执行高放大显微术,必须使用低射束.
高射束是用于将表面的材料溅出或移除,例如对模具进行高精确铣削或剖面切削.
