英语翻译摘要：本文研究了添加比重为0.3%、0.5%、0.7%纳米TiO2颗粒对SnAgCu无铅钎料的组织、熔点、显微硬
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This paper studies the adding proportion is 0.3%,0.5%,0.7% of TiO2 nano particles on the microstructure of SnAgCu solder,melting point,hardness and mechanical properties of solder joint effects,the results show that,TiO2 nano particles added obviously refines the microstructure of brazed brazing joint,improve the mechanical properties and thermal stability.The comprehensive performance of which added 0.5% TiO2 nanoparticlescomposite solder has the best,compared with the SnAgCu lead-free solder,low melting point 1.7 C,joint interface intermetallic compound (IMC) layer thickness is about 4.9 m,compared to SAC solder (9 m) significantly decreased,tensile strength and shear strength are 69.3MPa and 72.6MPa,were increased by 26.7% and 21.2%.

Keywords:compound strength of nano titanium dioxide lead-free solderintermetallic

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